Press-Fit Technology, a Solderless Method for Mounting Power Modules

摘要

Press-Fit technology offers the possibility of leadfree solderless mounting of power modules. Advantages of this new technology for power modules in comparison to existent technologies are shown. Results regarding high current behaviour, vibration loads and mounting are presented. The measured low electrical and thermal contact resistance show the ability to use the contact technology for a wide range of currents and applications.