Abstract: This paper presents a fiber optic packaging technique using qualifiable materials and processes that has been developed for space applications. The technique is consistent with a Multi Chip Module implementation. This packaging technique allows multiple fiber optic interfaces to be combined with high density electronics within a single easily integrable package and can be used wherever fiber optics are incorporated into spaceborne systems, including the Fiber Optic Data Bus, the Space Station FDDI interface, any upgrades of the Space Station Local Bus from 1553 to 1773, and various Dual Rate 1773 applications.!5
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