Investigation on the Impact on Thermal Performances of New Pin and Fin Geometries Applied to Liquid Cooling of Power Electronics

摘要

Liquid cooling of coldplates and baseplates appears to be the near-term solution for the currentrncooling demand of the power electronics market. Although well-known manufacturing methodsrncan produce adequate coldplates and baseplates for liquid cooling, new manufacturing processesrnand associated new geometries could significantly improve the hydrodynamic and thermal performancesrnof current solutions. A numerical and experimental investigation has been carried outrnin order to evaluate the impact on the thermal performances of new pin and fin geometries appliedrnto liquid cooling of power electronics. It is concluded that new geometries can provide a significantrnimprovement on the thermal performances.