Intelligent power module family SKiiP - 4th generation

摘要

Applications such as renewable energy, traction or elevators require a progressive increasing reliabilityrnand power density of the power electronics. These usually contradicting demands ask for unique andrninnovative electronic integration and packaging. An innovative pressure contact system for a maximumrnhomogenous current distribution, higher maximum junction temperatures as well as low temperaturerndiffusion sintering die attach and digital based signal transmission of the gate driver are leading thernway to fulfill these requirements. A combination of these technologies leads to the fourth generation ofrnSEMIKRON SKiiP intelligent power modules. The baseplate less power section has a 100% solder freerndesign that exceeds the reliability and power density limits of known industrial packages.