首页> 外文会议>The Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference amp; Exhibition Jul 8-13, 2001, Kauai, Hawaii >EFFECT OF INTERFACIAL WEIGHT LOSS BY SILVER MIGRATION ON THE PULLOUT STRENGTH OF SILVER WIRE EMBEDDED IN AN ADHESIVE MATRIX
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EFFECT OF INTERFACIAL WEIGHT LOSS BY SILVER MIGRATION ON THE PULLOUT STRENGTH OF SILVER WIRE EMBEDDED IN AN ADHESIVE MATRIX

机译:银迁移引起的界面重量损失对胶粘剂基质中嵌入的银线的抗拉强度的影响

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In this study an effort is made to correlate interfacial weight loss, by migration, from the surface of silver wire embedded in adhesive matrix, to bond strength between the silver wire and the adhesive matrix. Comparative studies are also performed using aluminum wire in place of silver to accurately assess the effect of interfacial weight loss by silver migration. The results of the pullout tests on silver migrated specimens are compared with pullout tests on silver-wire specimens, which were immersed in water for 2 hours but without silver migration. Pullout tests are performed in both wet, and dry condition of the bonded specimens. It is determined that the pull-out strength of bonded silver-wire specimens in wet condition decrease by as much as 86%, subsequent to silver migration. The loss of bond strength for silver-migrated specimens tested in dry condition varies between 23% and 4%, depending on the embedded lengths used.
机译:在这项研究中,人们努力使界面重量损失(通过迁移)从嵌入胶粘剂基质中的银丝表面迁移到银丝和胶粘剂基质之间的粘合强度上。还使用铝线代替银来进行比较研究,以准确评估因银迁移引起的界面失重的影响。将银迁移样本的拉拔测试结果与银线样本的拉拔测试进行比较,将银线样本浸入水中2小时,但没有银迁移。拉伸试验在粘合样品的湿和干条件下进行。可以确定,在潮湿条件下,银迁移后,键合银线样品的抗拉强度降低了多达86%。在干燥条件下测试的银迁移样品的粘结强度损失在23%和4%之间变化,具体取决于所使用的嵌入长度。

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