University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;
University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;
University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;
University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;
University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;
Ghent University - IMEC, Photonics Research Group, iGent Tower - Department of Information Technology (INTEC) Technologiepark-Zwijnaarde 15, B-9052 Gent, Belgium;
Ghent University - IMEC, Photonics Research Group, iGent Tower - Department of Information Technology (INTEC) Technologiepark-Zwijnaarde 15, B-9052 Gent, Belgium;
University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;
optics; photonics; laser; hybrid integration; photonic packaging; micro-optical bench;
机译:III-V-ON-SILICON集成:从混合装置到异构光子集成电路
机译:波长可调激光器与硅光子集成电路的混合集成
机译:光子封装:将硅光子集成电路转变为光子器件
机译:低成本干涉测量医疗装置硅光子集成电路激光源的混合集成
机译:具有异质硅III / V上光子集成电路的带环形镜的可调谐激光器。
机译:具有双极化双平衡同相和正交检测的硅光子集成电路扫频源光学相干层析成像接收机
机译:低成本干涉测量医疗装置硅光子集成电路激光源的混合集成