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Hybrid Integration of Laser Source on Silicon Photonic Integrated Circuit for low-cost Interferometry Medical Device

机译:用于低成本干涉测量医疗设备的硅光子集成电路上激光源的混合集成

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摘要

The cost-effective integration of laser sources on Silicon Photonic Integrated Circuits (Si-PICs) is a key challenge to realizing the full potential of on-chip photonic solutions for telecommunication and medical applications. Hybrid integration can offer a route to high-yield solutions, using only known-good laser-chips, and simple free-space micro-optics to transport light from a discrete laser-diode to a grating-coupler on the Si-PIC. In this work, we describe a passively assembled micro-optical bench (MOB) for the hybrid integration of a 1550nm 20MHz linewidth laser-diode on a Si-PIC, developed for an on-chip interferometer based medical device. A dual-lens MOB design minimizes aberrations in the laser spot transported to the standard grating-coupler (15μm × 12μm) on the Si-PIC, and facilitates the inclusion of a sub-millimeter latched-garnet optical-isolator. The 20dB suppression from the isolator helps ensure the high-frequency stability of the laser-diode, while the high thermal conductivity of the A1N submount (30(W/m. ℃), and the close integration of a micro-bead thermistor, ensure the stable and efficient thermo-electric cooling of the laser-diode, which helps minimise low-frequency drift during the approximately ~ 15s of operation needed for the point-of-care measurement. The dual-lens MOB is compatible with cost-effective passively-aligned mass-production, and can be optimised for alternative PIC-based applications.
机译:激光源在硅光子集成电路(Si-PIC)上具有成本效益的集成是实现电信和医疗应用芯片上光子解决方案的全部潜力的关键挑战。混合集成可仅使用已知良好的激光芯片和简单的自由空间微光学器件就可将光从离散的激光二极管传输到Si-PIC上的光栅耦合器,从而提供高收益解决方案。在这项工作中,我们描述了一种无源组装的微光学工作台(MOB),用于将1550nm 20MHz线宽激光二极管混合集成到Si-PIC上,该芯片是为基于片上干涉仪的医疗设备开发的。双透镜MOB设计最大程度地减少了传输到Si-PIC上标准光栅耦合器(15μm×12μm)的激光光斑中的像差,并有助于包含亚毫米级的石榴石锁存光隔离器。隔离器的20dB抑制有助于确保激光二极管的高频稳定性,而A1N基座的高热导率(30(W / m。℃),以及微珠热敏电阻的紧密集成,可确保稳定,高效的激光二极管热电冷却功能,可将照护点测量所需的约15s操作期间的低频漂移降至最低,双透镜MOB可与经济高效的被动式兼容量产,并且可以针对基于PIC的替代应用进行优化。

著录项

  • 来源
    《Optical Interconnects XVII》|2017年|1010915.1-1010915.17|共17页
  • 会议地点 San Francisco(US)
  • 作者单位

    University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;

    University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;

    University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;

    University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;

    University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;

    Ghent University - IMEC, Photonics Research Group, iGent Tower - Department of Information Technology (INTEC) Technologiepark-Zwijnaarde 15, B-9052 Gent, Belgium;

    Ghent University - IMEC, Photonics Research Group, iGent Tower - Department of Information Technology (INTEC) Technologiepark-Zwijnaarde 15, B-9052 Gent, Belgium;

    University College Cork, Tyndall National Institute, Photonic Packaging Group, Dyke parade, Cork, Ireland;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    optics; photonics; laser; hybrid integration; photonic packaging; micro-optical bench;

    机译:光学;光子学激光;混合整合;光子包装;微光学平台;

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