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NANOSCALE TOUGHENING FOR ADVANCED COMPOSITE MATRICES CURED BY ELECTRON BEAM ACTIVATION

机译:电子束活化导致的先进复合材料的纳米复合强化

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摘要

The crosslinking polymerization of multifunctional monomers is known to yield rather brittle matrices, therefore limiting the development of this technique for the production of high performance composite materials. To improve composite damage tolerance, we are currently developing original acrylate-based formulations with interesting properties. Our toughened resins show optimized K_(Ic) values over 2 MPa.m~(0.5) while it is about 1 MPa.m~(0.5) for the unmodified resin. By studying the related toughening mechanisms, this improvement was found to be linked with the nanoscale features of the resins. High T_g values (over 160℃) are also reachable in conjunction with high toughness. Flexural properties are also satisfactory with corresponding moduli above 3 GPa. In addition, the low viscosity of some of these systems makes them very interesting for liquid based processes, such as Resin Transfer Molding (RTM) since the viscosity falls down to less than 1 Pa.s above 60℃, with still significant injection window. In order to demonstrate the feasibility of all the process sequence and to evaluate composite properties, a carbon-fiber reinforced plate showing superior damage tolerance was successfully manufactured using the RTM technique and X-ray initiated polymerization.
机译:已知多官能单体的交联聚合产生相当脆的基质,因此限制了该技术用于生产高性能复合材料的发展。为了提高复合材料的耐损伤性,我们目前正在开发具有有趣特性的原始丙烯酸酯基配方。我们的增韧树脂在2 MPa.m〜(0.5)范围内显示出最佳的K_(Ic)值,而未改性树脂的K_(Ic)值约为1 MPa.m〜(0.5)。通过研究相关的增韧机理,发现这种改善与树脂的纳米级特征有关。高T_g值(超过160℃)也可以达到,同时具有高韧性。弯曲性能也令人满意,相应的模量高于3 GPa。另外,这些系统中的一些低粘度使其对于基于液体的工艺(例如树脂传递模塑(RTM))非常有趣,因为在60℃以上时粘度下降至小于1 Pa.s,并且注射窗口仍然很大。为了证明所有工艺步骤的可行性并评估复合材料的性能,使用RTM技术和X射线引发的聚合反应成功地制造了具有优异耐损伤性的碳纤维增强板。

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  • 来源
  • 会议地点 Seattle WA(US)
  • 作者单位

    Universit(e) de Reims Champagne-Ardenne, CNRS UMR 6229, Institut de Chimie Moleculaire de Reims, BP 1039, 51687 Reims Cedex 2, France;

    rnEADS Astrium Space Transportation Avenue du G(e)n(e)ral Niox, BP20011, 33165 Saint-Medard-en-Jalles Cedex, France;

    rnLaboratoire de Microscopies et d'Etude de Nanostructures, LMEN EA3799 21 rue Clement Ader, 51685 Reims Cedex 2, France;

    rnUniversit(e) de Reims Champagne-Ardenne, CNRS UMR 6229, Institut de Chimie Moleculaire de Reims, BP 1039, 51687 Reims Cedex 2, France;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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