CFD Modeling for Component-level Thermal Analysis:Investigation of Thermal Regime of Integrated Circuits and Transistors

摘要

The continuous trend in modern electronics industry to reduce the amount of electronic components while increasing their reliability and functional application determines the need for innovative methods of management of the thermal processes aimed at effective mitigation of thermal loads. The main role of systemic thermal design is not predicting the temperature of the components, but rather to reduce risk factors for failure related to temperature. In this study numerical-experimental approaches and programming are used to determine the heat in voltage regulators. Three-dimensional mathematical modeling and thermal analysis are carried out by computer fluid dynamics (CFD) using the commercially available software Flotherm. To confirm the accuracy of numerical simulations which model the thermal efficiency of electronic components experiments are carried out and the temperature in some control points are measured in a special experimental setup with the help of thermocouples.