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The measurement of the adhesion force between ceramic particles and metal matrix in ceramic reinforced-metal matrix composites

机译:陶瓷增强金属基复合材料中陶瓷颗粒与金属基体之间粘附力的测量

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This paper presents the method for measurement of the adhesion force and fracture strength of the interface between ceramic particles and metal matrix in ceramic reinforced-metal matrix composites. Three samples with the following Cu to Al_2O_3 ratio (in vot.%) were prepared: 98.0Cu/2.0Al_2O_3, 95.0Cu/5.0Al_2O_3 and 90Cu/10Al_2O_3. Furthermore, microwires which contain a few ceramic particles were produced by means of electro etching- The microwires with clearly exposed interface were tested with use of the microtensiie tester. The microwires usually break exactly at the interface between the metal matrix and ceramic particle. The force and the interface area were carefully measured and then the fracture strength of the interface was determined. The strength of the interface between ceramic particle and metal matrix was equal to 59±8 MPa and 59±11 MPa in the case of 2% and 5% Al_2O_3 to Cu ratio, respectively. On the other hand, it was significantly lower (38±5 MPa) for the wires made of composite with 10% Al_2O_3.
机译:本文提出了一种测量陶瓷增强金属基复合材料中陶瓷颗粒与金属基体界面粘合力和断裂强度的方法。制备具有以下Cu与Al_2O_3之比(以体积%计)的三个样品:98.0Cu / 2.0Al_2O_3、95.0Cu / 5.0Al_2O_3和90Cu / 10Al_2O_3。此外,通过电蚀刻产生包含少量陶瓷颗粒的微丝。使用微张力测试仪测试具有清晰暴露的界面的微丝。微丝通常恰好在金属基体和陶瓷颗粒之间的界面处断裂。仔细测量力和界面面积,然后确定界面的断裂强度。当Al_2O_3与Cu的比例为2%和5%时,陶瓷颗粒与金属基体之间的界面强度分别等于59±8 MPa和59±11 MPa。另一方面,由具有10%Al_2O_3的复合材料制成的金属丝的电阻值明显较低(38±5 MPa)。

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