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Influence of Stacking Fault Energy on the Microstructures and Grain Refinement in the Cu-Al Alloys during Equal-Channel Angular Pressing

机译:等通道角挤压过程中堆垛层错能对Cu-Al合金组织和晶粒细化的影响

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摘要

The microstructural evolution and grain refinement of Cu-Al alloys with different stacking fault energies (SFEs) processed by equal-channel angular pressing (ECAP) were investigated. The grain refinement mechanism was gradually transformed from dislocation subdivision to twin fragmentation with tailoring the SFE of Cu-AI alloys. Concurrent with the transition of grain refinement mechanism, the grain size can be refined into from ultrafine region (1 μm~ 100 nm) to the nanoscale (<100 nm) and then it is found that the minimum equilibrium grain size decreases in a roughly linear way with lowering the SFE. Moreover, in combination with the previous results, it is proposed that the formation of a uniform ultrafine microstructure can be formed more readily in the materials with high SFE due to their high recovery rate of dislocations and in the materials with low SFE due to the easy formation of a homogeneously-twinned microstructure.
机译:研究了等通道转角挤压(ECAP)处理的具有不同堆垛层错能(SFE)的Cu-Al合金的组织演变和晶粒细化。通过调整Cu-Al合金的SFE,晶粒细化机制逐渐从位错细分转变为孪晶碎裂。随着晶粒细化机理的转变,可以将晶粒尺寸细化为从超细区域(1μm〜100 nm)到纳米级(<100 nm),然后发现最小的平衡晶粒尺寸呈大致线性减小降低SFE的方法。此外,结合先前的结果,提出在具有高SFE的材料中由于其高的位错回复率而在具有低SFE的材料中以及由于容易的位错恢复率而在具有SFE的材料中更容易形成均匀的超微结构。均匀缠绕的微结构的形成。

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