SEMICONDUCTOR IC PACKAGING-OVERVIEW AND TRENDS

摘要

The rapid growth and escalating cost competitiveness of today's personal computer, communication and consumer electronics markets have driven semiconductor IC manufacturers to offer products with more functions per chip, higher operating speeds, and lower cost packaging. To remain competitive in this environment, IC manufacturers and contract assemblers must place greater emphasis on developing high density, small profile, fine lead pitch, plastic molded surface mount packages with satisfactory electrical and thermal characteristics.rnThis paper presents a packaging overview, packaging function and application requirements, and packaging technology drivers, packages currently available and under development, and packages of special interest. It also covers advances in the area of die attach and chip interconnections, as well as assembly and packaging technology trends. In addition, it also includes a discussion related to contract assembly infrastructure issues.