Laser-induced metal deposition and laser cutting techniques for fixing IC design errors

摘要

Abstract: The local modification of an integrated circuit (IC) requires in general the availability of three generic processes. First, a method for cutting conductors must be provided. Second, a process for depositing new conductors must be available. Finally, a means of opening via holes through the chip passivation to the underlying conductors is needed; this operation enables newly deposited conductors to make connections to the existing circuit elements, and also provides probe access to facilitate testing of the circuit. In this paper we present laser-based techniques that perform these three functions, and describe the operation of a versatile tool that we have constructed and applied to the repair of ICs. !5