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Thermal transport through solid-solid interface with an interlayer

机译:通过与夹层的固-固界面进行热传输

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Nonequilibrium molecular dynamics (NEMD) approach is developed to investigate the thermal transport across a solid-solid interface between two different materials with an interlayer around it. The effects of system size and the interlayer material's properties on the interface thermal resistance are considered in our model. The NEMD simulations show that the addition of an interlayer between two highly dissimilar lattices depresses the interface thermal resistance effectively. Meanwhile, the effective thermal conductivity along the direction of heat flux is enhanced with the increasing system temperature. Moreover, the interface thermal resistance after including an interlayer does not depend strongly on the simulation system size.
机译:非平衡分子动力学(NEMD)方法被开发用于研究两种不同材料之间的固-固界面上的热传递,并在其周围形成中间层。在我们的模型中考虑了系统尺寸和中间层材料特性对界面热阻的影响。 NEMD模拟表明,在两个高度不同的晶格之间添加中间层可有效降低界面热阻。同时,随着系统温度的升高,沿热通量方向的有效热导率增加。而且,包括中间层之后的界面热阻在很大程度上不取决于仿真系统的尺寸。

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