Novel hierarchically-dimensioned deformable mirrors with integrated ASIC driver electronics

摘要

We report on an effort of building a new form of deformable mirror (DM) driven by an array of giant piezo microactuators and being integrated with an ASIC driver electronics. The actuator layer is obtained by bonding a thin Si wafer with a thin PMN-PT crystal substrate, and is in attachment with a bulk-micromachined mirror hierarchy comprising of a supporting Si layer as the spacer, a Si post layer as the motion sampler, and atop of which a Si micromembrane layer as the deformable mirror. The ASIC employs a charge controlled approach to actuate the large capacitance (～nF) in associating with the high-energy-density actuators, capable of charging/discharging an array from quasi-static to 20 kHz framing rate, and with ultra-low-power dissipation that approximates the theoretical minimum of a driver electronics. The DM to ASIC integration is currently accomplished at chip level. An integrated DM prototype has 32×32 actuator elements at 600um pitch, weighing ～50 grams, as compact as ～1 cubic inch, and uses 25 wires to access the 1024 actuators. Fundamental characterizations of a few ASIC drivers are also presented.