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Thermal characteristics analysis of high power 808nm bar facial array

机译:高功率808nm栏面部阵列的热特性分析

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In order to optimize the output parameters of 808nm array of high-power microchannel heat sink package, the fluid thermodynamic characteristics of 50 × 10 array were simulated. The thermal distribution of the simulation results was used to guide the array assembly. The spectral characteristics of each bar in the stacked array were observed by near-field fiber scanning probe. The simulation results show that the flow rate of the stacked bar decreases gradually from bottom to top, the temperature of the bar increases gradually, and the flow rate of each stacked bar decreases slowly as it is far away from the water outlet. When the flow rate at the entrance of the stack array is 10 L/min, the temperature difference between the bottom and top bar of a single stack array is 13.1 °C, the flow rate difference is 0.24 L/min, and the FWHM width of the stack array spectrum can reach 4.5nm. The temperature of the active region is calculated by measuring the wavelength shift of each bar in a single stacked array, and the results are consistent with the simulation results. The spectral characteristics of the array can be effectively improved by assembling the array according to the temperature distribution.
机译:为了优化808nm阵列的高功率微通道散热器封装的输出参数,模拟了50×10阵列的流体热力学特性。模拟结果的热分布用于引导阵列组件。通过近场光纤扫描探针观察堆叠阵列中的每个杆的光谱特性。仿真结果表明,堆叠条的流速从底部到顶部逐渐减小,杆的温度逐渐增加,并且每个堆放条的流速在远离水口时缓慢降低。当堆叠阵列入口处的流量为10L / min时,单叠阵列的底部和顶部杆之间的温差为13.1°C,流量差为0.24L / min,而FWHM宽度堆栈阵列频谱可以达到4.5nm。通过测量单个堆叠阵列中每个杆的波长偏移来计算有源区的温度,结果与模拟结果一致。通过根据温度分布组装阵列,可以有效地改善阵列的光谱特性。

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