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The Impact-emap 2014, 9th International conference on electronics, materials and packaging, and the 16th International symposium on electronic materials and packaging: Thesis for study analysis of memory packaging and testing industry

机译:2014年的影响 - Emap 2014,第9届电子,材料和包装国际会议,以及第16届电子材料和包装国际研讨会:记忆包装和测试行业研究分析论文

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Taiwanese memory packaging and testing factories include Powertech, ChipMOS, ASE, SPIL, Walton and FATC. The global three first tier giants, Samsung Electronics, Hynix and Micron, have predicted that the DRAM market in 2014 will be more stable. With the three-giant monopolization taking shape, the strategic alliance and corresponding excess profits of back-end packaging factories are expected to be gradually improved. The computex new products covering semiconductors/components, green energy efficiency, Fujitsu wafer manufacturing, packaging and testing, and memories, etc. are going to take to the stage and Taiwanese IC design related firms are scrambling to grab any business opportunities. All of these will be sensationally showcased at the Taipei International Computer Show. 3D NAND will be the future trend and price competition will be the challenge of respective factories. SK Hynix and Samsung will race to launch green semiconductors, with which the information center trade will turn out to be the biggest customer. NAND Flash will march into the corporate storage market and the conventional storage trade will face a greater challenge. Fujitsu is optimistic about the demand for 4G transistors in 2014, in which the demand will be much stronger in the second half. Samsung and STMicroelectronics will expand its contract manufacturing of 28nm FD-Soi. SPIL, a packaging and testing factory, will devote its efforts to becoming the world 2 largest packaging factory. As indicated by its president Lin Wen-Bo, as sustained by the popularity of smart phones, the demand for advanced semi-conductor packaging will continue to remain strong in 2014 which will lead to continuation of the profits. According to Korea, Times, the world number one technology giant Samsung has boasted its memory chip business, but the business has now been put to the tough test. For green energy efficiency and Taiwan's solar power integration, Morris Chang will be the key decision maker- Google will invest 600 million US dollars in the data center at Lenoir of North Carolina, and participate in foundry services. Apple's release of orders will offer more business opportunities, with which production of smart phones and components will expand.
机译:台湾内存包装和测试工厂包括Powertech,Chipmos,ASE,Spil,Walton和Fatc。全球三层第一层巨头,三星电子,海洋密封和微米,预测2014年的DRAM市场将更加稳定。随着三巨头垄断的垄断,预计后端包装工厂的战略联盟和相应的过剩利润将逐步改善。 Computex新产品覆盖半导体/元件,绿色能效,富士通晶圆制造,包装和测试,以及记忆等将采取舞台和台湾IC设计相关公司争抢任何商业机会。所有这些都将在台北国际电脑展上被敏感地展示。 3D NAND将是未来的趋势和价格竞争将是各自工厂的挑战。 SK Hynix和三星将竞选绿色半导体,信息中心贸易将成为最大的客户。 NAND Flash将进入企业存储市场,传统的储存贸易将面临更大的挑战。富士通对2014年对4G晶体管的需求持乐观态度,其中需求将在下半部分更强大。三星和STMicroelectronics将扩大其28nm FD-SOI的合同制造。 SPIL,一种包装和测试工厂,将致力于成为世界2个最大的包装工厂。正如林文博总统所示,正如智能手机的普及所持续的那样,2014年对先进半导体包装的需求将继续保持强劲,这将导致利润的延续。据韩国,时代,世界第一科技巨头三星已经吹嘘了内存芯片业务,但业务现已推出艰难的测试。对于绿色能源效率和台湾的太阳能集成,莫里斯·张将是关键决策者 - 谷歌将在北卡罗来纳州北卡罗来纳州Lenoir的数据中心投资600万美元,并参加铸造服务。 Apple的订单发布将提供更多的商机,其中智能手机和组件的生产将扩大。

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