首页> 外文会议>International Conference on Advances in Manufacturing and Materials Engineering >Resistive switching of Cu/Cu2O junction fabricated using simple thermal oxidation at 423 K for memristor application
【24h】

Resistive switching of Cu/Cu2O junction fabricated using simple thermal oxidation at 423 K for memristor application

机译:使用简单的热氧化在423 k下的Memitristor应用中使用简单的热氧化来电阻切换Cu / Cu2o结

获取原文

摘要

Recently, extensive researches have been done on memristor to replace current memory storage technologies. Study on active layer of memristor mostly involving n-type semiconductor oxide such as TiO2 and ZnO. This paper highlight a simple water vapour oxidation method at 423 K. to form Cu/Cu2O electronic junction as a new type of memristor. Cu2O is a p-type semiconductor oxide, was used as the active layer of memristor. Cu/Cu2O/Au memristor was fabricated by thermal oxidation of copper foil, followed by sputtering of gold. Structural, morphological and memristive properties were characterized using XRD, FESEM, and current-voltage, I-V measurement respectively. Its memristivity was indentificd by pinch hysteresis loop and measurement of high resistance state (HRS) and low resistance stale (LRS) of the sample. The Cu/Cu2O/Au memristor demonstrates comparable performances to previous studies using other methods.
机译:最近,在Memristor上完成了广泛的研究来替换当前的存储器存储技术。 椎间膜活性层的研究主要涉及N型半导体氧化物,如TiO2和ZnO。 本文突出了423 k下的简单水蒸气氧化方法。作为一种新型椎间盘,形成Cu / Cu2o电子结。 Cu2O是p型半导体氧化物,用作椎间的有源层。 通过铜箔的热氧化来制造Cu / Cu2O / Au椎间盘,然后溅射金。 使用XRD,FESEM和电流电压,I-V测量来表征结构,形态和椎间膜特性。 它的存储器是通过捏合滞后回路和测量样品的高电阻状态(HRS)和低电阻陈列(LRS)的封闭率。 Cu / Cu2O / Au Memristor使用其他方法表明了先前研究的可比性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号