A Novel Patternable Electrophoretic Polymer Coating for Sidewall Packaging in Microelectronic Devices

摘要

This paper presents a novel patternable electrophoretic polymer (EPP) coating technology for sidewall package in microelectronic devices. The main features of this EPP film are directly patterned via through-mask electrophoretic deposition. The proposed EPP coating has some overwhelming merits against other coating polymers, such as self-patterning via through-mask deposition, good adhesive performance, selective coating, low cost and compatible with IC process. The focus is on the process, patterning, properties characterization and application of this novel electrophoretic polymer. The main applications can be aimed for electrical/thermal isolations or sidewall packaging in semiconductor device package.