Today, as global environmental regulations are being tightened, both IC and package technologies are also becoming far more complicated. More Moore and more than Moore, which manifest themselves in system-on-chip (SoC) and system-in-a-package (SiP), respectively, are being used more in combination to meet the ever-more-stringent cost and time-to-market requirements of consumer products with more functions built in them. In this presentation, I will review the challenges and opportunities to IC packaging as a direct outcome of the above trends to ensure SoC and SiP based IC packages meet the needs of the present generation without compromising the ability of future generations.
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