Flexible Thin Film Packaging for Organic Displays and Electronics

摘要

1. Glass based displays with thin film encapsulation have met telecommunications specifications for lifetime. 2. The same process works for encapsulation of displays on flexible substrates (steel foil, plastic). R&D encapsulation equipment is being delivered for mixed substrate application 3. The proven performance of thin film encapsulation on glass is being used to optimize deposition processes and barrier performance of plastic barrier film. 4. A combination of flexible substrate and flexible encapsulation will be required to realize flexible displays and electronics.