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Tin-Zinc Alloy Electroplating and Its Corrosion Behavior

机译:锡锌合金电镀及其腐蚀行为

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A 70%Sn-30%Zn alloy is deposited from a neutral non-cyanide bath. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) show that it is composed of Sn and Zn phases. By use of an electrochemical quartz crystal microbalance (EQCM), the plating current efficiency is calculated. When the plated sample is exposed to a 0.5M Na{sub}2SO{sub}4 (pH=3.6) solution at open circuit potential (OCP), the EQCM measures the corrosion rate. The open circuit potential shows that the Zn dissolution reaction is the major reaction occurring at OCP. A linear potential scanning experiment shows that the anodic polarization current of this alloy is rather small in a wide range of potential until it reaches the anodic dissolution potential of pure Sn in the same solution.
机译:将70%Sn-30%Zn合金从中性非氰化物浴中沉积。扫描电子显微镜(SEM)和能量分散X射线光谱(EDS)表明它由Sn和Zn相组成。通过使用电化学石英晶体微稳定(EQCM),计算电流效率。当电镀样品暴露于开路电位(OCP)的0.5M Na {Sub} 2SO {Sub} 4(pH = 3.6)溶液时,EQCM测量腐蚀速率。开路电位表明,Zn溶解反应是在OCP处发生的主要反应。线性电位扫描实验表明,该合金的阳极偏振电流在宽范围的潜力中相当小,直到它达到相同溶液中纯Sn的阳极溶解电位。

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