Recent Advances in Plating Power Supply Technology Capabilities

摘要

Increasing demands are being placed on electroplating processes. When new baths and additives make marginal improvements, realizing significant potential gains from recent advances in power supply technology may satisfy or even drive demands. The power supply plays a basic role in deposition rate, deposit distribution, crystal grain size, structure and surface morphology. Recent power supply advances from telecommunication and consumer product applications can improve pulse plating quality, capability and throughput by proper implementation into the plating power supply. This paper will benchmark traditional rectifier advances and include new technology. Benefits will be presented from advanced features, improved specifications, multiple wave shapes and improved automation capabilities. For comparison, data will be provided on plating difficult geometries from prior rectifiers and the new technologies.