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DESIGN AND FABRICATION OF A CASCADED ELECTRO-THERMAL BIMORPH ACTUATOR

机译:级联电热双芯片致动器的设计和制造

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Here a cascaded bimorph actuator is proposed by integrating several novel actuation units to accumulate the vertical displacements. Each actuation unit comprises two types of bimorph beams and a constraint bar, and both beams will stretch outward with respect to the constraint bar while heating. In comparison with other three conventional bimorph actuator designs at the same device size, it is shown that the proposed design can provide larger vertical displacement. The proposed cascaded bimorph actuator is fabricated by surface micromachining technique and released by XeF_2 silicon isotropic etching. Whole suspended structure consisting of the polysilicon and the aluminum is around 510 x 400 μm~2 with four actuation units. The resistance is about 650 Ω. In testing, the fabricated device is shown to provide reversible vertical displacement of 22.5 μm at 4.5 V, and the operating temperature is measured by an infrared thermal microscope (InfraScope II, QFI). The calibrated maximum temperatures are compared with simulated results by ANSYS 6.0 in good agreement. It is found that the maximum temperature is 147°C when the input voltage is 4.5 dc volts, and the maximum temperature is below 400°C even at 10 V. However, it is found that the residual stress in the suspended structure will affect the vertical displacement of the device.
机译:这里提出了一种级联的Bimorph致动器,通过集成几个新颖的致动单元来积聚垂直位移。每个致动单元包括两种类型的双压电束和约束杆,并且两个梁在加热时将相对于约束杆向外伸展。与其他三个传统的双熔芯致动器设计相同的装置尺寸相比,示出了所提出的设计可以提供更大的垂直位移。所提出的级联双芯片致动器由表面微机械技术制造并由XeF_2硅各向同性蚀刻释放。由多晶硅和铝制成组成的整个悬浮结构约为510×400μm〜2,具有四个致动单元。电阻约为650Ω。在测试中,示出了制造的装置,以在4.5V下提供22.5μm的可逆垂直位移,并且通过红外热显微镜(Infascope II,QFI)测量操作温度。将校准的最大温度与ANSYS 6.0的模拟结果进行比较,同意良好。发现当输入电压为4.5直流伏特时,最大温度为147°C,即使在10 V时,最高温度也低于400°C。但是,发现悬挂结构中的残余应力将影响设备的垂直位移。

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