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Microstructure and High Through-thickness Thermal Conductivity of Graphite Fiber Composite for Structural Applications

机译:结构应用石墨纤维复合材料的微观结构和高贯穿厚度导热性

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Combinations of nanoscale and microscale silver particles were used to construct heterogeneously conductive paths in graphite composites for improving through-thickness thermal conductivity. Composites with four different pitch-based graphite fibers were studied and compared to realize the improved thermal conductivity with adequate mechanical performance. The test panels of EWC300X graphite fibers and sliver fillers achieved a through-thickness thermal conductivity of ~10.0 W/m·K at 25 °C. The rheological behavior of Epon862/curing agent resin and silver flakes filled Epon862/curing agent resin was studied for the standardization and quality control of large panel fabrication. By adding 40wt% silver flakes in the resin system, the viscosity greatly increased. The lowest viscosity of 40% silver flakes filled Epon862/cu ring agent resin system occurred at 65 °C; therefore, the curing process was modified accordingly to ensure resin/fiber wetting and reduction of voids. The hybrid composites with IM7 and pitch-based carbon fiber were also made in order to optimize the composite performance with a balanced thermal conductivity and mechanical properties. The failure mechanisms of laminated composites with and without silver fillers were investigated. The IM7/EWC300X hybrid composite with a density of 2.31 g/cm~3 showed a thermal conductivity of 5.29 W/m·K and adequate mechanical properties for structural applications.
机译:纳米级和微尺度银颗粒的组合用于构建石墨复合材料中的非均匀导电路径,用于改善厚度的导热率。研究了具有四种不同沥青石墨纤维的复合材料,并比较了实现具有足够的机械性能的改善的导热性。 EWC300X石墨纤维的试验板和粘连填料在25℃下实现了〜10.0W / m·k的贯穿厚度导热率。研究了EPON862 /固化剂树脂和银薄片填充EPON862 /固化剂树脂的流变行为,用于大面板制造的标准化和质量控制。通过在树脂体系中加入40wt%的银薄片,粘度大大增加。 40%银薄片的最低粘度填充EPON862 / Cu环剂树脂系统在65℃下发生;因此,相应地修饰固化过程,以确保树脂/纤维润湿和减少空隙。还进行了具有IM7和俯仰基碳纤维的杂化复合材料,以优化具有平衡导热性和机械性能的复合性能。研究了具有和不含银填料的层压复合材料的失效机制。密度为2.31g / cm〜3的IM7 / EWC300X杂化复合材料显示出5.29W / m·K的导热率和用于结构应用的足够的机械性能。

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