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Unfolded Modular Multiplication

机译:展开的模块化倍增

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摘要

Sedlak's [Sed] modular multiplication algorithm is one of the first real silicon implementations to speed up the RSA signature generation [RSA] on a smartcard, cf. [DQ], Although it is nearly unknown in the scientific literature on cryptographic hardware it received in the practical smartcard world a considerable amount of interest, cf. [HP1, HP2,NMR]. The reason why it is so unknown might be given by the fact that the original publication was extremely hard to read and that Sedlak didn't explain all the subtle implementation Issues. Theoretically, Sedlak's algorithm needs on average n/3 steps (i.e., additions/subtractions) to compute the modular product (α·β mod v) for α,β and v being n-bit numbers. The main result of this paper is that Sedlak's algorithm can be practically speeded up by an arbitrary integral factor i > 2, i.e., our new algorithm needs on average n/(3 · i) steps in order to compute the modular product (α·β mod v). A further contribution of this paper is the mathematically proper and reader-friendly derivation of Sedlak's algorithm leading naturally to our main result.
机译:SEDLAK的[SED]模块化乘法算法是第一个真正的硅实现之一,以加快智能卡上的RSA签名生成[RSA],CF. [DQ],虽然在实际智能卡世界中收到的加密硬件上的科学文学中几乎是未知的。 [HP1,HP2,NMR]。它是如此未知的原因可能是由于原始出版物非常困难,并且Sedlak没有解释所有细微的实施问题。从理论上讲,SEDLAK的算法平均不需要N / 3步骤(即,添加/减去)来计算α,β和V的模块化产品(α·βMODv)是n位数。本文的主要结果是,SEDLAK的算法可以通过任意积分I> 2,即,我们的新算法在平均n /(3·i)步骤上需要进行,以计算模块化产品(α· βmod v)。本文的进一步贡献是SEDLAK算法的数学上适当和读者友好推导,其主要是我们的主要结果。

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