INVESTIGATION OF MICROSTRUCTURAL EVOLUTION OF COLD ROLL BONDED AND ANNEALED Ti-Al MULTILAYERED SHEETS

摘要

In this study, the thickness of the interfacial intermetallic layer that forms at the Ti-Al interface during annealing of roll bonded Ti-Al multilayers was investigated. To monitor the growth of these interfacial layers as a function of reduction levels, annealing experiments were performed at temperatures of 600oC and 620oC for various annealing times. The final microstructure depended on the reduction level of the initial foils, annealing temperature, and annealing time.