A NEW FABRICATION METHOD FOR 3-D MICROSTRUCTURES USING SURFACE-ACTIVATED BONDING OF THIN FILMS

摘要

We propose a new fabrication method for 3-D microstructures using surface-activated bonding (SAB) of thin films. This method is a kind of layer manufacturing technique for metallic or dielectric microstructures with an accuracy of sub-micrometers. In our method called FORMULA (Formation of μ-structures by lamination), all sliced patterns for microstructures are first formed on a donor substrate by photolithography, then they are transferred and laminated onto a target substrate using SAB. Because various materials can be photolithographically patterned and bonded by SAB, metallic or dielectric microstructures can be formed directly. It was successfully demonstrated that aluminum patterns were transferred and laminated on the target substrate to construct many microstructures at a time.