A multi-layer plastic packaging technology for miniaturized bio analysis systems containing integrated electrical and mechanical functionality

摘要

A multi-layer plastic packaging technology has been developed for microfluidic systems containing electrical and mechanical functionality. Hot embossing and beat staking of plastics, micro stenciling of electrodes, and stereolithography (SLA) was combined with conventional MEMS fabrication techniques to realize the system. The approach allows for multiple materials of fabrication, provides a solution to integration of electrical functionality throughout the system, and provides an interconnect technology for interfacing fluids and electrical components between the macro and the micro worlds.