FormFactor is developing a wafer-level back-end solution, encompassing wafer-level package, wafer-level burn-in, high speed test at the wafer-level, and assembly to printed circuit boards. The primary element is a MicroSpring contact, a resilient, compliant spring. The MicroSpring contacts have proven to be durable in Probe Card applications, and robust in LGA production sockets. Early reliability testing is showing that the MicroSpring contact is establishing new benchmarks for CSPs, both atpackage and at board level. All of the elements of the wafer-level process have been demonstrated, and further pre-production characterization and qualification is continuing.
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