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A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance

机译：用于金属间化合物的依杀基铅免焊料中纳米颗粒的研究及降液试验性能

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《Electronic Components and Technology Conference》|2006年||共21页
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Amagai M.;
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中图分类自动化技术、计算机技术;
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2. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate [J] . G.K. Sujan, A.S.M.A. Haseeb, A.B.M. Afifi Materials Characterization . 2014,第Null期

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3. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate [J] . S.L. Tay, A.S.M.A. Haseeb, Mohd Rafie Johan Intermetallics . 2013,第Null期

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4. A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance [C] . Amagai, M. Electronic Components and Technology Conference, 2006. Proceedings. 56th . 2006

机译：SnAg基无铅焊料中金属间化合物中的纳米颗粒及其跌落试验性能的研究
5. Investigation of bulk solder and intermetallic failures in lead-free BGA by joint level testing. [D] . Tumne, Pushkraj Satish. 2009

机译：通过联合液位测试研究无铅BGA中的散装焊料和金属间故障。
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

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7. Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints [O] . Bernasko Peter Kojo 2012

机译：无铅焊点金属间化合物层形成，生长及抗剪强度评估研究

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