Improvements in the reliability and manufacturability of an integrated RF power amplifier module system-in-package, via implementation of conductive epoxy adhesive for selected SMT components

摘要

style="font-variant: small-caps; font-size: .9em;">First Page of the Article class="img-abs-container" style="width: 95%; border: 1px solid #808080;" src="/xploreAssets/images/absImages/01216478.png" border="0">

著录项

• 来源
  《Electronic Components and Technology Conference, 2003. Proceedings. 53rd》||p.1404-1407|共4页
• 会议地点
• 作者

  Cavasin D.; Ken Brice-Heames; Arab A.;

• 作者单位
• 会议组织
• 原文格式 PDF
• 正文语种
• 中图分类
• 关键词