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Performance Analysis of Enhancement Mode Composite Channel MOSHEMT Device for Low Power Applications

机译:低功耗应用增强模式复合通道MOSHEMT器件的性能分析

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High Electron Mobility Transistor (HEMT) is currently playing a major role in electronics industries for low and high-power applications along with high frequency operations. In this paper, simulation of single gate enhancement mode InAs based composite channel MOSHEMT devices is performed for low power applications leading to the superior analog and RF performances. This performance is achieved by focusing the work towards the lattice matched composite channel, a recessed gate structure, HfO2 gate dielectric, and optimized source to drain spacing. The device performance characteristics are systematically analyzed with the optimized device dimensions of gate length (LG) = 50 nm, Barrier thickness (TB) = 3 nm, channel thickness (TCH) = 15 nm for the various gate to drain spacing. The reduction of a gate to drain spacing helps in minimizing the drain resistance and increased electron velocity. This effects in improving the transconductance (gm), drain current (ID), cutoff frequency (ft) along with the expense of short channel effects.
机译:高电子迁移率晶体管(HEMT)目前在电子行业的低功率和高功率应用以及高频操作中起着重要作用。在本文中,针对低功率应用进行了基于单栅极增强模式InAs的复合通道MOSHEMT器件的仿真,从而获得了出色的模拟和RF性能。通过将工作集中于晶格匹配的复合沟道,凹入式栅极结构HfO来实现此性能。 2 栅极电介质,以及优化的源极到漏极间距。通过优化的栅极长度(L)器件尺寸来系统分析器件性能特征 G )= 50 nm,阻挡层厚度(T B )= 3 nm,通道厚度(T CH )= 15 nm对于不同的栅极到漏极间距。栅极到漏极间距的减小有助于最小化漏极电阻并提高电子速度。这有助于提高跨导(gm),漏极电流(I D ),截止频率(ft)以及短通道效应的代价。

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