Effect of Micron Thermal Conductive Filler on Thermal Conductivity and Electrical Properties of Epoxy Composites

摘要

With the increase of the voltage level, the high-voltage equipment will generate more heat during the operation, so there is a higher requirement for the thermal conductivity of the epoxy resin insulation material. It is a simple and effective method to fill the resin with a high thermal conductive material BN. However, the compatibility of BN with the matrix is low, and the improvement of thermal conductivity is limited. In this paper, the BN filler is modified by a coupling agent (KH-560), and the treated BN is filled into an epoxy resin to prepare a composite material. After modification, the composite material has higher thermal conductivity and better dielectric properties, and the breakdown strength of the composite material is improved after filling an appropriate amount of BN.