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Temperature analysis of electronic devices for reliability design based on Process Neural Network

机译:基于过程神经网络的可靠性设计电子设备温度分析

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Aiming at reliability design for electronic devices, process neural networks are proposed to predict the temperature of electronic devices. To avoid errors caused by discrete input data fitting or difference, only discrete data is used when solving orthogonal transformation coefficients. To accelerate the learning speed of the gradient descent algorithm, a parameter- independent adaptive learning algorithm is developed. The results show that this model has better accuracy and generalization ability compared with artificial neural networks and linear regression method, and the parameter-independent adaptive learning algorithm has quicker convergence rate compared with parameter-fixed algorithm and adaptive learning algorithm.
机译:针对电子设备的可靠性设计,提出了过程神经网络来预测电子设备的温度。为了避免由离散输入数据拟合或差异引起的错误,在求解正交变换系数时仅使用离散数据。为了加快梯度下降算法的学习速度,开发了一种参数独立的自适应学习算法。结果表明,与人工神经网络和线性回归方法相比,该模型具有更好的准确性和泛化能力,与参数固定算法和自适应学习算法相比,参数独立的自适应学习算法具有更快的收敛速度。

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