Flexible substrate with movable device island supported by serpentine interconnect for mounting ultra-thin silicon chips

摘要

We have developed novel flexible substrates to integrate ultra-thin silicon chips on stretchable textiles like wearable devices. The flexible substrates have device islands for the ultra-thin silicon chips supported by serpentine interconnects joined to edges with electrode pads. On attaching to stretchable textiles, only the edges are adhered so that the device islands are movable, which means nearly zero-stress application to the ultra-thin chips. 3-mm-thick silicon chips mounted on the “zero-stress flexible substrates” are not broken against 150% of strain.