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Selective Enhancement of Randomness at the Materials Level: Poly-Si Based Physical Unclonable Functions (PUFs)

机译:在材料级别上选择性增强随机性:基于多晶硅的物理不可克隆函数(PUF)

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Physically Unclonable Functions (PUFs) were introduced over a decade ago for a variety of security applications. Silicon PUFs exploit uncontrollable random variations from manufacturing to generate unique and random signatures/responses. Existing research on PUFs has focused on either PUF design at the architectural level or optimization of lithography to increase sensitivity to random process variations. However, such sources of randomness may become limited during standard CMOS manufacturing as processes continue to mature especially with the advances in design for manufacturability. In this paper, poly-Si is proposed to improve PUF quality at the materials level. Compared to conventional single crystal Si (sc-Si), defects and trapped charges resulting from the random distribution of crystal grains and grain boundaries (GBs) in poly-Si offer considerable random variations. By using poly-Si only in the PUF region in devices, the randomness of the PUF can be enhanced without impacting other functional circuits and thus the IC yield can be maintained. RO-PUF simulation results based on a poly-Si field effect transistor (FET) model show that compared to sc-Si based PUFs, the reliability of poly-Si based PUFS can be improved from 89.18% to 98.82%.
机译:物理上不可克隆的功能(PUF)于10年前被引入,用于各种安全应用程序。硅PUF利用制造过程中不可控制的随机变化来生成唯一且随机的签名/响应。现有的关于PUF的研究集中在体系结构级别的PUF设计或光刻的优化上,以提高对随机过程变化的敏感性。但是,随着工艺的不断成熟,特别是随着可制造性设计的进步,这种随机性来源在标准CMOS制造过程中可能会受到限制。在本文中,提出了多晶硅以提高材料级别的PUF质量。与传统的单晶硅(sc-Si)相比,多晶硅中晶粒的随机分布和晶界(GBs)导致的缺陷和陷阱电荷提供了相当大的随机变化。通过仅在器件的PUF区域中使用多晶硅,可以增强PUF的随机性而不会影响其他功能电路,因此可以保持IC成品率。基于多晶硅场效应晶体管(FET)模型的RO-PUF仿真结果表明,与基于sc-Si的PUF相比,基于多晶硅的PUFS的可靠性可以从89.18%提高到98.82%。

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