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Improving focus performance at litho using diffraction-based focus metrology, novel calibration methods, interface and control loop

机译:使用基于衍射的聚焦度量,新颖的校准方法,界面和控制环来改善光刻的聚焦性能

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In advanced optical lithography the requirements of focus control continues to tighten. Usable depth of focus (DoF) is already quite low due to typical sources of focus errors, such as topography, wafer warpage and the thickness of photoresist. And now the usable DoF is further decreased by hotspots (design and imaging hotspots). All these have put extra challenges to improve focus metrology, scanner focus stability calibrations and on-product correction mechanisms. Asymmetric focus targets are developed to address robustness in focus measurements using diffraction-based focus (DBF and μDBF) metrology. A new layout specific calibration methodology is introduced for baseline focus setup and control in order to improve scanner focus uniformity and stability using the measurements of the above mentioned asymmetric targets. A similar metrology is also used for on product focus measurements. Moreover, a few novel alternative methods are also investigated for on-product focus measurements. Data shows good correlation between DBF and process on record (POR) method using traditional FEM. The new focus calibration demonstrated robustness, stability and speed. This technical publication will report the data from all the above activities including results from various product layers.
机译:在高级光学光刻中,聚焦控制的要求不断提高。由于典型的聚焦误差源(例如形貌,晶圆翘曲和光刻胶厚度),可用的聚焦深度(DoF)已经非常低。现在,热点(设计和成像热点)进一步降低了可用的DoF。所有这些都给改善聚焦计量,扫描仪聚焦稳定性校准和产品校正机制带来了额外的挑战。使用基于衍射的聚焦(DBF和μDBF)计量技术开发非对称聚焦目标以解决聚焦测量中的鲁棒性。引入了一种新的布局特定的校准方法,用于基线聚焦的设置和控制,以便使用上述非对称目标的测量结果来提高扫描仪聚焦的均匀性和稳定性。类似的度量也用于产品聚焦测量。此外,还研究了一些新颖的替代方法来进行产品上的焦点测量。数据显示DBF与使用传统FEM的记录过程(POR)方法之间具有良好的相关性。新的聚焦标定显示出鲁棒性,稳定性和速度。本技术出版物将报告上述所有活动的数据,包括各个产品层的结果。

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