RF communications and radar systems are comprised of tightly packaged high wattage components requiring a controlled temperature to meet performance and reliability parameters. As these systems are becoming smaller and more powerful, existing thermal management technology limits system performance. An approach being pursued to address thermal management issues is localized synthetic jet die-level cooling using embedding piezoelectric actuators within the electronic assembly. U.S. Army AMRDEC is developing and testing piezocomposite actuator test beds to mature the concepts and develop practical solutions. This investigation has demonstrated Lightweight Piezocomposite Curved Actuator (LiPCA) devices as low-frequency, small form factor, high-displacement, and high flow rate sources for synthetic jet cooling. The goal of the investigation is to achieve thermal management using higher efficiency and smaller actuators than demonstrated in previous synthetic jet efforts.
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