首页> 外文会议>IEEE Sensors >Fabrication challenges of lab-on-chip: An overview of the challenges that have hindered lab-on-chip development, how this may now be dealt with for prototype development and low-to moderate volume manufacture, and finally how this might be dealt with for future high-volume manufacture
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Fabrication challenges of lab-on-chip: An overview of the challenges that have hindered lab-on-chip development, how this may now be dealt with for prototype development and low-to moderate volume manufacture, and finally how this might be dealt with for future high-volume manufacture

机译:芯片实验室的制造挑战:概述了阻碍芯片实验室开发的挑战,现在如何应对原型开发和中小批量生产的挑战,以及如何应对用于未来的大批量生产

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For several decades the task of putting chemical and biological procedures into a microfabricated package has offered the prospect of fundamentally changing how we delivery health care. Unfortunately, despite lofty goals, tremendous efforts worldwide, and many years, to date the impact of these lab-on-chip technologies has been significantly less than expected. That said, technology development has now proceeded to the point that some applications are now viable, and these chould provide the momentum to further develop the field. This invited talk will explore challenges in MEMS in application to lab on chip - it will discuss the progress made, the primary challenges and likely routes forward. The talk will begin by looking at the technical requirements for effective use, how these were addressed in early work and how they are being addressed at the present time. The talk will discuss recent advances in the areas of thermal control, optical sensing and fluidic control, areas that are of fundamental importance in the development of the field. At the conclusion, an outline will be given showing how sufficient resources can be brought to bear such that fully integrated, low-cost devices could soon be built, while dealing with the need for substantial non-recurring engineering (NRE) on the one hand, and for high-volume manufacture on the other.
机译:几十年来,将化学和生物学程序放入微细包装中的任务为从根本上改变我们提供医疗保健的方式提供了前景。不幸的是,尽管有远大的目标,但全球范围内以及多年来的巨大努力,迄今为止,这些片上实验室技术的影响远远小于预期。就是说,技术发展现在已经到了某些应用程序可行的地步,这些应用程序将为进一步发展该领域提供动力。此次受邀的演讲将探讨MEMS在芯片实验室应用中的挑战-它将讨论取得的进展,主要挑战以及可能的发展途径。演讲将首先探讨有效使用的技术要求,在早期工作中如何解决这些要求以及当前如何解决这些要求。演讲将讨论热控制,光学传感和流体控制领域的最新进展,这些领域在该领域的发展中至关重要。最后,将给出一个大纲,该大纲显示如何可以利用足够的资源来尽快构建完全集成的低成本设备,同时一方面满足对大量非经常性工程(NRE)的需求。 ,另一方面用于大批量生产。

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