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Correlation of actinic blank inspection and experimental phase defect printability on NXE3x00 EUV scanner

机译:浅析空白检测与实验阶段缺陷印刷性对NXE3X00 EUV扫描仪的相关性的相关性

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One challenge of extreme ultraviolet (EUV) mask defectivity is the severe printability of defects of the multi-layer (ML) mirror on the mask. These ML-defects are just nanometer high or deep local distortions of this ML mirror. Dedicated blank inspection tools have become available over time. One of them is the actinic blank inspection tool under development through EIDEC (Lasertec ABI). EIDEC and imec have jointly correlated its blank defect detection capability to wafers printed on ASML NXE3100 and NXE3300 scanners. Printing ML-defects were identified by wafer inspection, followed by subsequent repeater analysis, and correlated back to blank inspection. Forward correlation of ABI detections to the printed wafer was also successfully undertaken. The focus of this work has been on native defects. This paper will discuss the obtained results from the perspective of how to use ABI to assess which kind of native ML defects need to be avoided during blank fabrication.
机译:极端紫外线(EUV)掩模缺陷的一个挑战是掩模上的多层(ML)镜缺陷的严重可印刷性。这些ML缺陷仅是该ML镜的纳米高或深层局部扭曲。专用空白检测工具已随着时间的推移而可用。其中一个是通过EIDEC(Lasertec Abi)正在开发的Actinic空白检查工具。 EIDEC和IMEC已将其空白缺陷检测能力联合关联,以在ASML NXE3100和NXE3300扫描仪上印刷的晶片。通过晶片检查鉴定印刷M1缺陷,然后进行后续的中继器分析,并将回到空白检查。还成功地成功地进行了ABI检测对印刷晶片的前向相关性。这项工作的重点是原生缺陷。本文将通过如何使用ABI来讨论所获得的结果,以评估在空白制造期间需要避免哪种天然M1缺陷。

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