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Novel Ultra Low Leakage FinFET Based SRAM Cell

机译:基于SRAM细胞的新型超低泄漏FinFET

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摘要

To make portable battery operated devices moreefficient with low leakage current is a major challenge with the technology scaling. The power dissipation is expected to increase further in next generation technologies because of the exponential increase in leakage currents with technology scaling. FinFET device was introduced as a suitable replacement of CMOS due to its reduced short channel effects at lower technology nodes. However, leakage current still remains comparable to device ONcurrent at highly scaled technology nodes. Continuous voltage supply to retain the data in SRAM cell contributes a major part of leakage current in any processor design. This paper proposed a novel circuit technique to reduce the leakage current and power consumption of SRAM cell. The proposed design achieves a very high reduction in static power dissipation, up to 4% reduction in read power and upto 49% reduction in write power dissipation as compared to conventional FinFET 6T SRAM cell. All the HPSICE simulation is performed using 32nm BSIM technology file.
机译:为了使便携式电池供电的设备融入低泄漏电流是技术缩放的主要挑战。由于具有技术缩放的漏电流的指数增加,预计功耗将在下一代技术进一步增加。由于下较低技术节点的短信效应降低,因此引入了FinFET器件作为CMOS的合适替代。然而,漏电流仍然与高度缩放技术节点的设备磁性通道仍然相当。连续电压源保留SRAM单元中的数据有助于任何处理器设计中的漏电流的主要部分。本文提出了一种新型电路技术,以降低SRAM电池的漏电流和功耗。与传统FinFET 6T SRAM单元相比,所提出的设计达到静态功耗的静态功耗降低,读取功率降低高达4%,并且写入功耗降低了49%。使用32nm BSIM技术文件执行所有HPSICE仿真。

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