The continual drive toward smaller second level interconnect dimensions, along with the introduction of Halogen-Free circuit board materials and increased process temperatures of Lead-Free solders, have all contributed to a more frequent occurrence of Pad Crater damage in circuit board materials during manufacturing and test processes. This paper addresses the methodology and test data of some common industry methods used to evaluate Pad Crater strength in circuit board materials. Pad Crater test data is highly sensitive to sample design; as a result a discussion of sample design criteria is also included.
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机译：不断朝着更小的第二级互连尺寸发展，以及引入无卤电路板材料和提高无铅焊料的工艺温度，所有这些都导致在制造和制造过程中电路板材料中更频繁地发生焊盘收口损坏。测试过程。本文介绍了一些用于评估电路板材料中焊盘弯曲强度的常见行业方法的方法学和测试数据。 Pad Crater测试数据对样品设计高度敏感;结果，还包括了样本设计标准的讨论。
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