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HIGH PURITY PROCESS PIPING: ADDITION OF CHAPTER X HIGH PURITY PIPING TO THE AS ME B31.3 PROCESS PIPING CODE

机译:高纯工艺配管:将第X章高纯配管添加到AS ME B31.3工艺配管代码中

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摘要

The 2010 Edition of the American Society of Mechanical Engineers (ASME) B31.3 Procecess Piping Code [1] includes a new chapter: Chapter X High Purity Piping. Chapter X covers industries listed in the scope of ASME B31.3 which use methods of fabrication, examination, inspection and testing different than other industries covered by the Code. Industries which have a need for cleanness and cleanability on a more demanding level, such as the semiconductor industry, which uses Semiconductor Equipment and Materials International (SEMI) Standards [2-4], and the pharmaceutical and bioprocessing industries, which use the ASME Bioprocessing Equipment (BPE) Standard [5], also reference ASME B31.3 for safety requirements. ASME B31.3 now addresses issues common to the semiconductor and biopharmaceutical industries. The new High Purity Fluid Service defined in Chapter X permits weld coupon examination in lieu of the 5% radiography required in Normal Fluid Service when orbital welding is used in fabrication. Industries that may not otherwise be considered as high purity, such as refineries, the chemical processing industry [6-7], solar panel fabrication and nuclear or petrochemical applications that could use tubing rather than pipe, may benefit from the fabrication technology introduced in Chapter X while meeting the safety requirements of the Code.
机译:美国机械工程师协会(ASME)2010年版B31.3过程管路代码[1]包括新的章节:第X章高纯度管路。第十章涵盖了ASME B31.3范围内列出的使用与本规范所涵盖的其他行业不同的制造,检验,检查和测试方法的行业。需要更高清洁度的行业,例如使用国际半导体设备和材料(SEMI)标准[2-4]的半导体行业以及使用ASME生物加工的制药和生物加工行业设备(BPE)标准[5],有关安全性要求,也请参考ASME B31.3。 ASME B31.3现在解决了半导体和生物制药行业常见的问题。当在制造中使用轨道焊接时,第X章中定义的新的高纯流体服务允许进行焊片检查,代替普通流体服务中要求的5%射线照相。可能不被视为高纯度的行业,例如炼油厂,化学加工行业[6-7],太阳能电池板制造以及可能使用管道而不是管道的核或石化应用,可能会受益于本章介绍的制造技术X,同时满足本规范的安全要求。

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