Simulation of Near-crack-tip Strain Fields on Single-crystal Silicon Wafer

摘要

The failure components made of silicon is an important issue in the electronic and nano-technological developments.A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented.The strain formulas around the crack tip of mode Ⅰ crack were deduced from linear elastic fracture mechanics.The strain fields around the crack tip were simulated and analyzed in detail.