On the Integration of Behavioral Component Descriptions in the Full-wave Transmission-line Modeling Method

摘要

The simulation of complex digital systems incorporating ICs, lumped components, and field phenomena is a necessary activity for many applications. Predicting the practical behavior of systems based upon just the schematical circuit diagrams (which indicate topology) fails to include the consequences of field effects (which require geometrical information), which given the ever increasing frequencies of modern digital systems, are of paramount importance. On the other hand, comprehensive simulation of IC packages using full-wave models is prohibitively computationally expensive and time consuming to complete. Embedding behavioral level descriptions of complex electronic components within a full-wave field solver circumvents these problems, and forms the subject of this paper. The Transmission-Line Modeling (TLM) method is used as the full-wave solver, and two behavioral models, "macro" and "IBIS", are embedded into the TLM to model the sources and loads presented by complex ICs. The two methods of representing the IC behavior are then illustrated and compared with a canonical test structure.