New module generation for higher lifetime

摘要

In the past decades, IGBTs and free wheeling diodes have become the components that define the performance of power modules for frequency inverters. This reflects not only the electrical parameters of the silicon dies but also the performance of the used assembly technologies. The assembly technologies define in first order the lifetime of power modules. In this paper we present the first Prime-PACK™ module built with a new set of joining technologies, called ".XT". The new technology will outperform the lifetime limitations known today. The discussed module has a nominal current of 900A and a blocking voltage capability of 1200V.