首页> 外文会议>2010 IEEE International Symposium on Electromagnetic Compatibility >Suppression of power/ground noise using meshed-planar electromagnetic bandgap (MP-EBG) structure for Ultra-Wideband (UWB) System-in-Package (SiP)
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Suppression of power/ground noise using meshed-planar electromagnetic bandgap (MP-EBG) structure for Ultra-Wideband (UWB) System-in-Package (SiP)

机译:使用网状平面电磁带隙(MP-EBG)结构抑制超宽带(UWB)封装系统(SiP)的电源/地面噪声

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In this paper, we propose the meshed-planar electromagnetic bandgap (MP-EBG) structure with a meshed planar surface embedded in the package power plane to suppress a power/ground noise in the frequency range from 3.1GHz to 10.6GHz, also known as the frequency band of Ultra-Wideband (UWB). The MP-EBG structure has two different EBG surfaces. One surface is a mushroom-like surface embedded between a package power and a ground plane and the other surface is a meshed planar structure embedded in a package power plane. The MP-EBG structure enables to enhance the bandwidth of the stopband in the limited package area and achieve the 8.7GHz stop bandwidth with −30dB isolation.
机译:在本文中,我们提出了一种网格平面电磁带隙(MP-EBG)结构,该结构具有嵌入封装电源平面的网格平面,以抑制3.1GHz至10.6GHz频率范围内的电源/地面噪声。超宽带(UWB)的频带。 MP-EBG结构具有两个不同的EBG表面。一个表面是嵌入在封装电源和接地平面之间的蘑菇状表面,而另一个表面是嵌入在封装电源平面中的网格状平面结构。 MP-EBG结构能够在有限的封装区域内增强阻带的带宽,并以-30dB的隔离度实现8.7GHz的阻带。

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