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Differential signal via shield with narrow via pitch partial electromagnetic bandgap structure

机译:具有窄通孔间距部分电磁带隙结构的差分信号通孔屏蔽

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This paper presents a signal via shielding method in a printed circuit board with the narrow via pitch partial electromagnetic bandgap (NVP-PEBG) structure. The NVP-PEBG structure was developed to shield a small area such as a signal via with wideband isolation and compact size. This NVP-PEBG structure showed excellent noise isolation for a single-ended signal via. In this paper, the NVP-PEBG structure is applied to a differential signal via and its performance with the differential signal via is demonstrated in coupling against the noise in a power and ground plane.
机译:本文提出了一种具有窄通孔节距部分电磁带隙(NVP-PEBG)结构的印刷电路板中的通孔屏蔽方法。 NVP-PEBG结构的开发旨在通过宽带隔离和紧凑尺寸来屏蔽信号通孔等较小区域。这种NVP-PEBG结构对单端信号过孔表现出出色的噪声隔离。本文将NVP-PEBG结构应用于差分信号过孔,并通过与电源和接地层中的噪声耦合来证明其与差分信号过孔的性能。

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