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A NEW INSTRUMENT FOR TENSILE TESTINGS OF THIN FREE STANDING FILMS AT HIGH STRAIN RATES

机译:用于高应变率的稀薄自由拉伸膜拉伸测试的新仪器

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The design of more reliable and sophisticated Micro Electro Mechanical Systems (MEMS) relies on the knowledge, understanding, and ability to control their mechanical response. In recent years, enormous progress has been made in developing new measurement techniques for studying the mechanical response of sub-micro scale specimens. However, there is still a lack of knowledge and testing techniques regarding the response of MEMS structures to mechanical shocks, which can appear during fabrication, deployment, or operation.We present an instrument for testing the mechanical response of thin free standing films under uniaxial tensile stress at high strain rates of up to 2x103 sec-1. The experimental system consists of a micro-device, which contains the freestanding specimen, and an external system, which includes instrumentation for measuring its mechanical response. The components of the external system are controlled by a single interface, and allow for a variety of displacement profiles to be applied to the specimens. All the instrumentation operates at high sampling rates (above 1 MHz) to allow for high strain rate application.The freestanding specimen is produced by MEMS fabrication techniques on a micro-device that also includes S-springs to protect the specimen and aluminum grating lines for measuring the displacement. One side of the chip is pulled by a piezoelectric translation stage, which allows controlling the displacement with a nanometric resolution and applying high velocities and accelerations. The specimen displacement is monitored by an optical encoder device that measure thedisplacement of the aluminum grating located on the micro-device close to the specimen with an accuracy of about 10 nm. The load is determined by measuring the charge on a piezoelectric PMN-30%PT shear plate, which is connected to the pin that holds the micro-device.The new instrument is applied for studying the response of thin aluminum films with thickness of 0.5-1 □m, width that varies between 5 to 50 □m, and length of 120 □m. The mechanical response of these specimens is measured at different strain rates and is compared to measurement done by nanoindentation.
机译:更可靠,更复杂的微机电系统(MEMS)的设计依赖于知识,理解和控制其机械响应的能力。近年来,在开发用于研究亚微尺度样品的机械响应的新测量技术方面已经取得了巨大进展。然而,仍然缺乏关于MEMS结构对机械冲击的响应的知识和测试技术,其可能在制造,部署或操作期间出现。 我们提出了一种用于在高达2x103 sec-1的高应变速率下测试单轴拉伸应力下的自立薄膜的机械响应的仪器。实验系统由一个微型设备和一个外部系统组成,该微型设备包含独立的样本,外部系统包括用于测量其机械响应的仪器。外部系统的组件由单个界面控制,并允许将各种位移轮廓应用到样本。所有仪器都以高采样率(高于1 MHz)工作,以允许高应变率应用。 独立式样品是通过MEMS制造技术在微型设备上生产的,该微型设备还包括用于保护样品的S形弹簧和用于测量位移的铝光栅线。芯片的一侧被压电平移台拉动,从而允许以纳米分辨率控制位移并施加高速度和加速度。样本位移由光学编码器设备监控,该设备可测量 位于微型设备上靠近样品的铝光栅的位移精度约为10 nm。负载是通过测量压电PMN-30%PT剪切板上的电荷来确定的,该剪切板上连接着固定微型设备的引脚。 该新仪器用于研究厚度为0.5-1□m,宽度在5到50□m之间,长度为120□m的铝薄膜的响应。在不同的应变速率下测量这些样品的机械响应,并将其与通过纳米压痕法进行的测量进行比较。

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