Techniques to characterize the structure of adhesive/dentin interfaces

摘要

@@Wet bonding technique [1] which involves separate acid etching and rinsing steps has led to higher bondstrength by preventing the collapse of demineralized dentin and enhancing the infiltration of adhesive intocollagen networks, as a result of wet bonding, a ca. 7 microns adhesive/dentin (a/d) interface will be formed. Thecontemporary self-etching adhesives/primers were designed to combine both the etching function and theresin-forming function, thus eliminating rinsing steps, at this case, a ca. 3 microns adhesive/dentin interface canbe formed. Compared to total-etch adhesives, self-etching adhesives are generally more user-friendly, lesstechnique sensitive and easer in achieving a hermetic seal. [2,3]. The structure of a/d interface plays a veryimportant role in determining the bonding quality. Many techniques have been employed to characterize thestructure of a/d interfaces. Such as SEM, TEM, staining method, SAM and micro-Raman and micro-tensile test.